3D and Circuit Integration of MEMS

3D and Circuit Integration of MEMS

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Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems 

MEMS and system integration are important building blocks for the ?More-Than-Moore? paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging… (more)

Book Details  

Publisher: Wiley-Vch (April 06, 2021)

Format: EPUB

Page count: 528 pages

File size: 146 MB

Protection: DRM

Language: English

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